Semiconductor chip soldering land pattern

专利名称：Semiconductor chip soldering land pattern发明人：Chihiro Araki申请号：US10063854申请日：20020520

公开号：US20020179327A1公开日：20021205

专利附图：

摘要：A semiconductor chip mounted on a substrate having a soldering land patternfor containing a molten solder interposed between said conductive surface and a facingsurface of the semiconductor chip. The soldering land pattern comprises corners spacedrespectively from the four corners of the semiconductor chip bottom surface and

escapes formed between the corners sufficiently outside of the respective sides of thesemiconductor chip bottom surface to accept liquid solder displaced from the areabetween the conductive surface and the facing surface of the semiconductor chip uponplacing the semiconductor chip within the soldering land pattern to improve conductivityand simplify the construction. The device is also shown in a motor control.

申请人：ARAKI CHIHIRO

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