专利名称：Flip chip semiconductor die internal signal
access system and method
发明人：Brian S. Schieck,Howard Lee Marks申请号：US12005716申请日：20071228
公开号：US20080128695A1公开日：20080605
专利附图：
摘要：A device and method for providing access to a signal of a flip chip
semiconductor die. A hole is bored into a semiconductor die to a test probe point. Thehole is backfilled with a conductive material, electrically coupling the test probe point to
a signal redistribution layer. A conductive bump of the signal redistribution layer iselectrically coupled to a conductive contact of a package substrate. An external accesspoint of the package substrate is electrically coupled to the conductive contact, such thatsignals of the flip chip semiconductor die are accessible for measurement at the externalaccess point.
申请人：Brian S. Schieck,Howard Lee Marks
地址：Hayward CA US,Gilroy CA US
国籍：US,US
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